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 MEMS Cooling

MEMS valve that self-regulates the flow rate of coolant according to the local temperature, without the need for external power or control electronics.  An electroplated nickel beam suspended over a narrow gap buckles when heated, opening the valve area to allow increased coolant flow rate through a microchannel heat exchanger.

In addition to implementing thermodynamic cycles for power generation, we wish to develop microsystems for cooling of electronics, sensors, or people.  As the computational power of microprocessors increase, so does their need for high heat flux cooling.  Novel approaches that allow high heat flux, but with minimal flow rate and pumping power are required in order to support these growing requirements.  Thermally challenging aerospace devices, such as gas turbine engines, ramjets, hypersonic vehicles would also benefit from advanced cooling approaches that would minimize coolant flow rates over a complete mission and hence improve their range and efficiency.  Current research in this area includes the development of adaptive MEMS-based cooling skin for high heat flux applications, which locally monitors the heat flux and adjusts the coolant rates to provide the minimal cooling required.  Future interests include vapor compression cooling microsystems for personal cooling.

Research Topics:

bulletAdaptive MEMS-based cooling skin
bulletVapor compression micro-personal air conditioner for people

Université de Sherbrooke - Faculty of Engineering - Mechanical Engineering

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Last modified: 2006-07-11